samfur: | Anti Metal 4025 |
RFID Chip: | NXP Ucode8, NXP Ucode9, Moza M730, Moza M750 Impinj R6 da ƙari. |
Girman Tag: | 40*25mm |
Aikace-aikace: | RFID Anti-karfe Tag |
Protocol: | ISO/IEC 18000-6C, EPCglobal Class 1 Gen 2 |
Yawan Aiki: | 860 ~ 960 MHz |
Ƙwaƙwalwar ajiya: | 48-bit TID, 96-bit EPC, 0-bit ƙwaƙwalwar mai amfani |
Bayanin aikace-aikacen: | Ana amfani da alamun RFID a wuraren da ƙarfe ke nan. |
Kewayon Aikace-aikacen | Gudanar da Kadari, Gudanar da Dabaru, Gudanar da Masana'antu |
Nau'in Samfur: | RFID Anti Metal Tag |
Kayan Chip: | Silicon Wafer |
Abun Fuska: | Farashin PET |
UHF Eriya: | AL+PET |
MOQ: | 1,000 inji mai kwakwalwa |
Misali: | 15 inji mai kwakwalwa don samfurori kyauta |
Bugawa: | Thermal canja wurin bugu |
Bayanin tattarawa: | Esd bag packing (Sauran Takaddun Takaddun Taimako na Musamman) |
Yawan Ga Kowane Rubutun: | 500 inji mai kwakwalwa/yi |
girman kwali: | 445*445*345mm |
Hanyar kwancewa: | Alamar fuska |
Diamita Na Ciki: | 3 inci |
Yanayin Zazzabi/Humidity: | -40°C zuwa +85°C/20% ~ 60% RH |
Ma'ajiya Zazzabi/Yushi: | 20 ~ 30 ℃ / 20% ~ 60% RH |
Rayuwar Shelf: | 1 shekara a cikin jakar anti-static a 20 ~ 30 ℃ / 20% ~ 60% RH |
ESD Voltage Immunity: | 2 kV (HBM) |
Lankwasawa Diamita: | 50mm ku |
Sauran buƙatun yanayin aikace-aikacen: | Abokan ciniki masoyi, ƙungiyar samfuran mu na iya ƙirƙira muku samfuran musamman bisa ga yanayin aikace-aikacenku na musamman.Da fatan za a gaya muku buƙatunku na musamman ga sabis na abokin ciniki a gaba, kuma za mu kammala ƙirar samfuran da aka keɓance muku a cikin kwanakin aiki biyu. |
Domin rage lokacinku da farashin ku a cikin Rubutu da bugu na shirin RFID, ƙungiyarmu ta ƙaddamar da siyan alamar RFID & sabis na fara bayanai ga abokan cinikinmu.Za mu samar muku da samar da alamar RFID, bugu na lakabi, EPC tari & EPC codeing sabis na tashar guda ɗaya, tare da ƙwararrun ƙwararrun ƙwararrun & kayan aiki mafi inganci.
Custom Chip: | NXP Ucode8, NXP Ucode9, Moza M730, Moza M750 da ƙari. |
Girman Al'ada | 65*35mm, 100*40mm, 65*5mm, 70*25mm da dai sauransu. |